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Footprint naming convention as used by the IPC-7351B andthe PCB Library Expert, the industry’s first footprint and 3D model automation tool to adopt this new guideline.
Library
Expert
Footprint
Naming
Convention
PCB Libraries, Inc.
October 4,2016
Library Expert Naming Convention for Standard SMD Land Patterns
Note: The component manufacturer’s abbreviated name followed by a hyphen can be used as a prefix for the elimination of duplicate footprint names. When the package tolerances deviate from one manufacturer to the next, the resulting footprint pad size and courtyard will be different but the footprint name will be the same. So in order to discriminate between various manufacturer’s package tolerances, we reco mmend that you use the component manufacturer’s abbreviated name followed by a hyphen as the footprint name prefix. Example: TI-QFN50P350X350X100-19_15T205X205 = Texas Instruments QFN for the RHL Case code.
See Appendix I for at the end of this document for the full list of all component manufacturer name abbreviations.
Component, Category |
Footprint Name |
Ball Grid Array’s......................................................................... |
BGA + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height |
BGA w/Dual Pitch............................................ |
BGA + Pin Qty + C or N + Col Pitch X Row Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height |
BGA w/Staggered Pins............................................................. |
BGAS + Pin Qty + C or N + Pitch P + Ball Columns X Ball Rows _ Body Length X Body Width X Height |
BGA Note: The C or N = Collapsing or Non collapsing Balls |
|
Capacitors, Chip, Array, Concave.................................................................................................. |
CAPCAV + Pitch P + Body Length X Body Width X Height Pin Qty |
Capacitors, Chip, Array, Flat.......................................................................................................... |
CAPCAF + Pitch P + Body Length X Body Width X Height Pin Qty |
Capacitors, Chip.............................................................................................................................................................. |
CAPC + Body Length + Body Width X Height |
Capacitors, Polarized, Chip........................................................................................................................................... |
CAPPC + Body Length + Body Width X Height |
Capacitors, Dual Flat No lead..................................................................................................................................... |
CAPDFN + Body Length + Body Width X Height |
Capacitors, Polarized, Dual Flat No lead................................................................................................................... |
CAPPDFN + Body Length + Body Width X Height |
Capacitors, Molded....................................................................................................................................................... |
CAPM + Body Length + Body Width X Height |
Capacitors, Polarized, Molded..................................................................................................................................... |
CAPPM + Body Length + Body Width X Height |
Capacitors, Aluminum Electrolytic .................................................................................................................................................. |
CAPAE + Base Body Size X Height |
Ceramic Flat Packages............................................................................................................................................ |
CFP127P + Lead Span Nominal X Height Pin Qty |
Column Grid Array, Circular Lead....................................................... |
CGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height |
Pillar Column Grid Array................................................................... |
PCGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height |
Crystals (2 leads) ............................................................................................................................................................. |
XTAL + Body Length X Body Width X Height |
Crystals, Dual Flat No lead........................................................................................................................................ |
XTALDFN + Body Length X Body Width X Height |
Crystals, Side Concave................................................................................................................................................. |
XTALSC + Body Length X Body Width X Height |
Diodes, Chip .................................................................................................................................................................... |
DIOC + Body Length + Body Width X Height |
Diodes, Dual Flat No lead........................................................................................................................... |
DIODFN + Body Length X Body Width X Height – Pin Qty |
Diodes, Molded............................................................................................................................................................. |
DIOM + Body Length + Body Width X Height |
Diodes, Non polarized Chip.......................................................................................................................................... |
DIONC + Body Length + Body Width X Height |
Diodes, Non polarized Molded.................................................................................................................................... |
DIONM + Body Length + Body Width X Height |
Diodes, MELF..................................................................................................................................................................... |
DIOMELF + Body Length + Body Diameter |
Diodes, Side Concave, 2 Pin............................................................................................................................ |
DIOSC + Body Length X Body Width X Height Pin Qty |
Diodes, Side Concave, 4 Pin.............................................................................................................. |
DIOSC+ Pitch P + Body Length X Body Width X Height Pin Qty |
Ferrite Bead, Chip......................................................................................................................................................... |
BEADC + Body Length + Body Width X Height |
Fuses, Chip ...................................................................................................................................................................... |
FUSC + Body Length + Body Width X Height |
Fuses, Dual Flat No Lead............................................................................................................................................ |
FUSDFN + Body Length + Body Width X Height |
Fuses, Molded............................................................................................................................................................... |
FUSM + Body Length + Body Width X Height |
Fuses, Side Concave....................................................................................................................................................... |
FUSSC + Body Length + Body Width X Height |
Inductors, Chip................................................................................................................................................................ |
INDC + Body Length + Body Width X Height |
Inductors, Chip, Array, Concave .................................................................................................... |
INDCAV + Pitch P + Body Length X Body Width X Height Pin Qty |
Inductors, Chip, Array, Flat............................................................................................................ |
INDCAF + Pitch P + Body Length X Body Width X Height Pin Qty |
Inductors, Dual Flat No lead....................................................................................................................................... |
INDDFN + Body Length + Body Width X Height |
Inductors, Molded......................................................................................................................................................... |
INDM + Body Length + Body Width X Height |
Inductors, Precision, Molded....................................................................................................................................... |
INDPM + Body Length + Body Width X Height |
Inductors, Side Concave................................................................................................................................................ |
INDSC + Body Length + Body Width X Height |
Land Grid Array, Circular Lead............................................................. |
LGA + Pin Qty + C + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height |
Land Grid Array, Square Lead.............................................................. |
LGA + Pin Qty + S + Pitch P + Pin Columns X Pin Rows _ Body Length X Body Width X Height |
LED’s, Chip....................................................................................................................................................................... |
LEDC + Body Length + Body Width X Height |
LED’s, Dual Flat No lead ............................................................................................................................................. |
LEDDFN + Body Length + Body Width X Height |
LED’s, Molded................................................................................................................................................................ |
LEDM + Body Length + Body Width X Height |
LED’s, Side Concave, 2 Pin.............................................................................................................................. |
LEDSC + Body Length X Body Width X Height Pin Qty |
LED’s, Side Concave, 4 Pin................................................................................................................ |
LEDSC + Pitch P + Body Length X Body Width X Height Pin Qty |
Oscillators, Dual Flat No lead....................................................................................................... |
OSCDFN + Pitch P + Body Length X Body Width X Height Pin Qty |
Oscillators, Side Concave................................................................................................................. |
OSCSC + Pitch P + Body Length X Body Width X Height Pin Qty |
Oscillators, Side Flat........................................................................................................................ |
OSCSF + Pitch P + Body Length X Body Width X Height Pin Qty |
Oscillators, J Lead............................................................................................................................... |
OSCJ + Pitch P + Body Length X Body Width X Height Pin Qty |
Oscillators, L Bend Lead .................................................................................................................... |
OSCL + Pitch P + Body Length X Body Width X Height Pin Qty |
Oscillators, Corner Concave.......................................................................................................................................... |
OSCCC + Body Length X Body Width X Height |
Plastic Leaded Chip Carriers............................................................................................. |
PLCC + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height Pin Qty |
Plastic Leaded Chip Carrier Sockets Square..................................................................... |
PLCCS + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height Pin Qty |
Quad Flat Packages ............................................................................................................ |
QFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height Pin Qty |
Ceramic Quad Flat Packages............................................................................................. |
CQFP + Pitch P + Lead Span L1 X Lead Span L2 Nominal X Height Pin Qty |
Quad Flat No lead ....................................................................................................... |
QFN + Pitch P + Body Length X Body Width X Height Pin Qty + Thermal Pad |
Pull back Quad Flat No lead...................................................................................... |
PQFN + Pitch P + Body Length X Body Width X Height Pin Qty + Thermal Pad |
© 2012 – 2018 PCB Libraries, Inc.
Quad Leadless Ceramic Chip Carriers................................................................................................... |
LCC + Pitch P + Body Length X Body Width X Height Pin Qty |
Quad Leadless Ceramic Chip Carriers (Pin 1 on Side) ......................................................................... |
LCCS + Pitch P + Body Length X Body Width X Height Pin Qty |
Resistors, Chip................................................................................................................................................................. |
RESC + Body Length + Body Width X Height |
Resistors, Chip, Array, Concave..................................................................................................... |
RESCAV + Pitch P + Body Length X Body Width X Height Pin Qty |
Resistors, Chip, Array, Convex, E Version (Even Pin Size)............................................................ |
RESCAXE + Pitch P + Body Length X Body Width X Height Pin Qty |
Resistors, Chip, Array, Convex, S Version (Side Pins Diff)............................................................ |
RESCAXS + Pitch P + Body Length X Body Width X Height Pin Qty |
Resistors, Chip, Array, Flat............................................................................................................. |
RESCAF + Pitch P + Body Length X Body Width X Height Pin Qty |
Resistors, Dual Flat No lead......................................................................................................................... |
RESDFN + Body Length X Body Width X Height – Pin Qty |
Resistors, MELF .................................................................................................................................................................. |
RESMELF + Body Length + Body Diameter |
Resistors, Molded........................................................................................................................................................... |
RESM + Body Length + Body Width X Height |
Resistors, Side Concave................................................................................................................................................. |
RESSC + Body Length + Body Width X Height |
Small Outline Diodes, Flat Lead.......................................................................................................................... |
SODFL + Lead Span Nominal + Body Width X Height |
Small Outline IC, J Leaded................................................................................................................................ |
SOJ + Pitch P + Lead Span Nominal X Height Pin Qty |
Small Outline IC, L Leaded............................................................................................................................... |
SOL + Pitch P + Lead Span Nominal X Height Pin Qty |
Small Outline Integrated Circuit, (50 mil Pitch SOIC)............................................................................................ |
SOIC127P + Lead Span Nominal X Height Pin Qty |
Small Outline Packages.................................................................................................................................... |
SOP + Pitch P + Lead Span Nominal X Height Pin Qty |
Small Outline No lead.................................................................................................. |
SON + Pitch P + Body Length X Body Width X Height Pin Qty + Thermal Pad |
Thermistors, Chip........................................................................................................................................................ |
THRMC + Body Length + Body Width X Height |
Pull back Small Outline No lead................................................................................ |
PSON + Pitch P + Body Length X Body Width X Height Pin Qty + Thermal Pad |
Small Outline Transistors, Flat Lead............................................................................................................. |
SOTFL + Pitch P + Lead Span Nominal X Height Pin Qty |
SOD (Example: SOD3717X135 = JEDEC SOD123)................................................................................................... |
SOD + Lead Span Nominal + Body Width X Height |
SOT143 & SOT343 (JEDEC Standard Package)................................................................................................. |
SOT + Pitch P + Lead Span Nominal X Height Pin Qty |
SOT143 & SOT343 Reverse (JEDEC Standard Package).............................................................................. |
SOT + Pitch P + Lead Span Nominal X Height Pin Qty + R |
SOT23 & SOT223 Packages (Example: SOT230P700X180 4) ........................................................................... |
SOT + Pitch P + Lead Span Nominal X Height Pin Qty |
TO (Generic DPAK Example: TO228P970X238 3).......................................................................................................... |
TO + Pitch P + Lead Span X Height Pin Qty |
Transistors, Dual Flat No lead..................................................................................................................... |
TRXDFN + Body Length X Body Width X Height – Pin Qty |
Varistors, Chip................................................................................................................................................................ |
VARC + Body Length + Body Width X Height |
Land Pattern Naming Convention Notes
All dimensions are in Metric Units
All Lead Span and Height numbers go two places past the decimal point and “include” trailing Zeros
All Lead Span and Body Sizes go two place before the decimal point and “remove” leading Zeros
All Chip Component Body Sizes are one place to each side of the decimal point
Pitch Values are two places to the right & left of decimal point with no leading Zeros but include trailing zeros
Naming Convention Special Character Use for Footprints
The _ (underscore) is the separator between pin qty. in Hidden & Deleted pin components and to append modifiers at the end The – (dash) is used to separate the pin qty.
The X (capital letter X) is used instead of the word “by” to separate two numbers such as height X width like “Quad Packages”.
Suffix Naming Convention for Footprints
Co mmon SMD Land Pattern to Describe Environment Use (This is the last character in every name) Note: This excludes the BGA component family as they only come in the Nominal Environment Condition
|
M................. |
Most Material Condition (Density Level A) |
|
N.................. |
Nominal Material Condition (Density Level B) |
|
L.................. |
Least Material Condition (Density Level C) |
Components with Hidden, Deleted or Reversed pins
Reverse Pin Order (or Mirrored Part)
-20RN.......... 20 pin part, Reverse Pin Order, Nominal Environment
Hidden Pins
-20_24N ...... 20 pin part in a 24 pin package. The pins are numbered 1 – 24 the hidden pins are skipped. The schematic symbol displays up to 24 pins.
Deleted Pins
-24_20N ...... 20 pin part in a 24 pin package. The pins are numbered 1 – 20. The schematic symbol displays 20 pins.
©2012 – 2018 PCB Libraries, Inc.
© 2012 – 2018 PCB Libraries, Inc.
Library Expert Naming Convention for Standard PTH* Land Patterns
Component, Category |
|
Footprint Name |
Capacitors, Non Polarized Axial Diameter Horizontal Mounting |
.........CAPAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter |
|
Example: CAPAD800W52L600D150 |
|
|
Capacitors, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50 |
||
Capacitors, Non Polarized Axial Rectangular......... |
CAPAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height |
|
Example: CAPAR800W52L600T50H70 |
|
|
Capacitors, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70 |
||
Capacitors, Non Polarized Axial Diameter Vertical Mounting ......... |
CAPADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter |
|
Example: CAPADV300W52L600D150 |
|
|
Capacitors, Non Polarized Axial; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50 mm
Capacitors, Non Polarized Axial Rect. Vert. Mtg. CAPARV + Lead Spacing + W Lead Width + L Body Length + T Body Thickness + H Body Height Example: CAPARV300W52L600T50H70
Capacitors, Non Polarized Axial Rect. Vertical; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70
Capacitors, Non Polarized Radial Diameter ....................................... |
CAPRD + Lead Spacing + W Lead Width + D Body Diameter + H Body Height |
Example: CAPRD200W52D300H550 |
|
Capacitors, Non Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50 |
|
Capacitors, Non Polarized Radial Rectangular....... |
CAPRR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height |
Example: CAPRR200W52L50T70H550 |
|
Capacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50 |
|
Capacitors, Non Polarized Radial Disk Button........ |
CAPRB + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height |
Example: CAPRB200W52L50T70H550
Capacitors, Non Polarized Radial Rectangular; lead spacing 2.00; lead width 0.52; Body Length 0.50; Body thickness 0.70; Height 5.50
Capacitors, Polarized Axial Diameter Horizontal Mounting |
................CAPPA + Lead Spacing + W Lead Width + L Body Length + D Body Diameter |
Example: CAPPAD800W52L600D150 |
|
Capacitors, Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50 |
|
Capacitor, Polarized Radial Diameter................................................. |
CAPPR + Lead Spacing + W Lead Width + D Body Diameter + H Body Height |
Example: CAPPRD200W52D300H550 |
|
Capacitors, Polarized Radial Diameter; lead spacing 2.00; lead width 0.52; Body Diameter 3.00; Height 5.50 |
|
Diodes, Axial Diameter Horizontal Mounting ....................................... |
DIOAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter |
Example: DIOAD800W52L600D150 |
|
Diodes, Non Polarized Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50 |
|
Diodes, Axial Diameter Vertical Mounting ......................................... |
DIOADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter |
Example: DIOADV300W52L600D150
Diodes, Non Polarized Axial; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Dual-In-Line Packages................................... |
DIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty |
Example: DIP762W52P254L1905H508Q14 |
|
Dual-In-Line Package: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14 |
|
Ceramic Dual-In-Line Packages .................. |
CDIP + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty |
Example: CDIP762W52P254L1905H508Q14 |
|
Ceramic Dual-In-Line Package: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14 |
|
Dual-In-Line Packages with Cavity .............. |
DIPC + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty |
Example: DIPC762W52P254L1905H508Q14
Dual-In-Line Package with Cavity: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14
Dual-In-Line Sockets....................................DIPS + Lead Span + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty Example: DIPS762W52P254L1905H508Q14
Dual-In-Line Package Socket: Lead Span 7.62; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 14
Transistor Outline, Flange Mount, Horizontal ................................................. |
TO + Pin Pitch P + Body Length X Body Width X Height Max – Pin Qty |
Example: TO170P2207X1028X470-5 |
|
Transistor Outline, Flange Mount: 1.70 Pin Pitch; 22.07 Body Length; 10.28 Body Width; 4.70 Height; 5 pins |
|
Transistor Outline, Flange Mount, Vertical...................................................... |
TO + Pin Pitch P + Body Length X Body Width X Height Max – Pin Qty |
Example: TO127P817X1028X2084-5 |
|
Transistor Outline, Flange Mount: 1.27 Pin Pitch; 8.17 Body Length; 10.28 Body Width; 20.84 Height; 5 pins |
|
Transistor Outline, Cylindrical............................................................................................ |
TO + Pin Pitch P + Body Diameter X Height Max – Pin Qty |
Example: TO508R895X660-4
Transistor Outline, Cylindrical: 5.08 Pin Radius; 8.95 Body Diameter; 6.60 Height; 5 pins © 2012 – 2018 PCB Libraries, Inc.
Header, vertical, 2.54 mm pitch; 0.635 mm lead width,20 pins,2 rows,10 pins per row,25.40 mm L X 2.54 mm W X 8.38 mm H body HDRV20W64P254_2X10_2540X254X838 – Example: vertical header, 2 rows by 20 pins:
Headers, Right Angle... HDRV + total Pins + W Lead Width + P Row Pitch (+ X Column Pitch [if different]) + _ Row s + X Pins per Row + _ Body Length + X Body Thickness + X Component Height + Proportional Pad Stacks
Header, right angle, 2.54 mm pitch; 0.635 mm lead width, 20 pins, 2 rows, 10 pins per row, 25.40 mm L X 2.54 mm W X 5.08 mm H body HDRRA20W64P254_2X10_2540X254X508 – Example: right angle header, 2 rows by 20 pins:
Headers, Right Angle. HDRRA + total Pins + W Lead Width + P Row Pitch (+ X Column Pitch [if different]) + _ Row s + X Pins per Row + _ Body Length + X Body Thickness + X Component Height + Proportional Pad Stacks
Header, vertical, 2.54 mm pitch; 0.635 mm lead width, 50 pins, 3 rows, 25 pins per row, 63.50 mm L X 2.54 mm W X 8.38 mm H body HDRV50W64P254_3X25_6350X254X838 – Example: vertical header, 3 rows by 25 pins with 25 missing ping pins:
Headers, Vertical HDRV + Total Pins + W Lead Width + P Row Pitch (+ X Column Pitch [if different]) + _ Row s + X Pins per Row + _ Body Length + X Body Thickness + X Component Height + Proportional Pad Stacks
Inductors, Axial Diameter Horizontal Mounting....................................INDAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: INDAD800W52L600D150
Inductors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Inductors, Axial Diameter Vertical Mounting .....................................INDADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter Example: INDADV300W52L600D150
Inductors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Jumpers, Wire................................................................................................................................................... |
JUMP + Lead Spacing + W Lead Width |
Example: JUMP500W52 |
|
Jumper; Lead Spacing 5.00; Lead Width 0.52 |
|
Mounting hole, plated; 8.70 mm land, 3.85 mm dia. hole, with 6 satellite vias |
|
Example: MTGP870H385V6 |
MTG + P (plated) + Land Size + H + Hole Size + V + No. of vias |
Mounting Hole............................................................................................................ |
|
Mounting hole, plated; 7.35 mm land, 3.85 mm dia. hole |
|
Example: MTGP735H385 |
MTG + P (plated) + Land Size + H + Hole Size |
Mounting Hole....................................................................................................................................... |
|
Mounting hole, non-plated, land = 50% of hole size but not the exceed 1.00 mm; 2.90 mm dia. hole, 3.89 mm anti-pad |
|
Example: MTGNP100H290Z389 |
MTG + NP (non-plated) + Inner Land Size + H + Hole Size + Z + Anti-pad size |
Mounting Hole..................................................................................... |
|
Mounting hole, non-plated with annular ring 5.00 mm land; 2.90 mm dia. hole, 3.89 mm anti-pad |
|
Example: MTGNPA500H290Z389 |
MTG + NP (non-plated) + A + Land Size + H + Hole Size + Z + Anti-pad size |
Mounting Hole........................................................................................ |
|
Oscillators ............................................... |
OSC + Lead Span + W Lead Diameter + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty |
Example for 8 pin Oscillator: OSC762W46P762L1320H600Q8
Oscillator: Lead Span 7.62; Lead Diameter 0.46; Pin Pitch 762; Body Length 13.20; Body Height 6.00; Pin Qty 8
Example for 14 pin Oscillator: OSC762W53P1524L2080H508Q14
Oscillator: Lead Span 7.62; Lead Diameter 0.53; Pin Pitch 762; Body Length 20.80; Body Height 508; Pin Qty 14
Pin Grid Array’s.............................PGA + Pin Qty + P Pitch + C Pin Columns + R Pin Rows + L Body Length X Body Width + H Component Height Example: PGA84P254C10R10L2500X2500H300
Pin Grid Array: Pin Qty 84; Pin Pitch 2.54; Columns 10; Rows 10; Body Length 25.00 X 25.00; Component Height 3.00
Resistors, Axial Diameter Horizontal Mounting |
...................................RESAD + Lead Spacing + W Lead Width + L Body Length + D Body Diameter |
Example: RESAD800W52L600D150 |
|
Resistors, Axial Diameter; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50 |
|
Resistors, Axial Diameter Vertical Mounting .................................... |
RESADV + Lead Spacing + W Lead Width + L Body Length + D Body Diameter |
Example: RESADV300W52L600D150 |
|
Resistors, Axial Diameter Vertical Mounting; Lead Spacing 3.00; Lead Width 0.52; Body Length 6.00; Body Diameter 1.50
Resistors, Axial Rectangular Horizontal Mounting...RESAR + Lead Spacing + W Lead Width + L Body Length + T Body thickness + H Body Height Example: RESAR800W52L600T50H70
Resistors, Axial Rectangular; Lead Spacing 8.00; Lead Width 0.52; Body Length 6.00; Body Thickness 0.50; Body Height 0.70
Single-In-Line Packages................................SIP + Body Width + W Lead Width + P Pin Pitch + L Body Length + H Component Height + Q Pin Qty Example: SIP150W52P254L1905H508Q8
Single-In-Line Package: Body Width 1.5; Lead Width 0.52; Pin Pitch 2.54; Body Length 19.05; Body Height 5.08; Pin Qty 8
Test Point; 0.635 mm lead width, round, 2.54 mm Diameter X 5.84 mm H body height. TPCW64D254H584 – Example: round test point with round or square lead:
Test Points,.................................................................................................................... TP + C + W + Lead Width + D + Body Diameter + H + Height
Test Point; 0.635 mm lead width, square, 2.54 mm W X 5.84 mm H body.
TPRW64L254H584 – Example: square test point with round or square lead:
© 2012 – 2018 PCB Libraries, Inc.
Test Points,............................................................................................................................ TP + R + W + Lead Width + L + Body Size + H + Height
The land pattern naming convention uses component dimensions to derive the land pattern name. The first 3 – 6 characters in the land pattern name describe the component family.
The first number in the land pattern name refers to the Lead Spacing or hole to hole location to insert the component lead. All numbers that follow the Lead Spacing are component dimensions.
These characters are used as component body identifiers that precede the value and this is the priority order of the component body identifiers – P = Pitch for components with more than two leads
W = Maximum Lead Width (or Component Lead Diameter) L = Body Length for horizontal mounting
D = Body Diameter for round component body
T = Body Thickness for rectangular component body H = Height for vertically mounted components
Q = Pin Quantity for components with more than two leads R = Number of Rows for connectors
Note: All component body values are in millimeters and go two places to the right of the decimal point and no leading zeros.
*PTH – Plated Through Hole
© 2012 – 2018 PCB Libraries, Inc.